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About Huaxin
Huaxin (Shenzhen) Vacuum Thermal Energy Equipment Co., Ltd used to be Shenzhen Kait Precision Equipment Co., Ltd., which was established in 2005. Due to the increasing development needs, we moved to the Songshan Lake Area and re-registered Huaxin (Shenzhen) Vacuum Thermal Energy Equipment Co., Ltd. in 2016.
Huaxin is located in Zhongji Digital Technology Industrial Park, Songshan Lake, Dongguan. With modern designing and manufacturing plant, Huaxin is a professional high-tech new enterprise specialized in research & development, production, sales of semiconductor equipment, automotive electronics equipment and SMT vacuum thermal soldering equipment, providing customers with one-stop solution.
Huaxin main products are:
1. Semiconductor vacuum reflow oven
2. Semiconductor formic acid vacuum reflow oven
3. Vacuum (nitrogen) reflow oven
4. Vacuum pressure soldering equipment
5. Anaerobic nitrogen silver paste oven
6. IGBT, automotive electronics, 3C electronics, vertical curing oven
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Main Products
Start a new journey from being the leader in China to being the leader in the world
Formic Acid Reflow Soldering Oven
Formic acid reflow soldering oven, is designed for non-flux soldering process. Combined with vacuum system, the formic acid reflow soldering oven can reduce the solder voiding to a big extent. It is mainly used for semiconductor and automotive electronics.
HSM Series Semiconductor Vacuum Oven
Equipped with the exclusive patented flux & paste collection system to reduce equipment maintenance and cleaning. The machine supports recipe functions for key soldering parameters and MES remote data reading. And intelligent nitrogen monitoring and control system, not only saves gas, but also has a lower oxygen content.
HTC Series Semiconductor Vacuum Oven
The patented water-cooled structure of the sealing ring, not only durable and lower cost of use, but also reduces costly product damage caused by poor sealing.
HX-V Series Vacuum Reflow Soldering Oven
The vacuum reflow soldering, using imported vacuum system, vacuum degree is lower, suitable for large boards, ultra-low void rate products.
HX-F Series Vacuum Reflow Oven
The upper cover is raised and lowered horizontally & synchronously,
which makes maintenance more convenient. And it supports recipe and MES remote data reading.
HX-M/F Series Vertical Curing Oven
This equipment is the vertical curing oven for semiconductor and SMT, turns horizontal heating to vertical one, with the advantages of saving energy and space. And heating system adopts 3-level protection to effectively prevent overtemperature and damage to the product.
HS Series of Single Temperature Zone Vertical Oven
The transportation chain of the equipment is driven by servo motor, and the program has the compensation function of high temperature thermal expansion and cold contraction in chain, which can effectively prevent the lifting chain from accumulating errors due to thermal expansion and contraction. And this equipment adopts an unique level + up & down air transportation, which is different from the traditional module, effectively prevent air dead angles due to too many products.
Our Advantages
1. We have more than 14 years’ experience in making SMT/DIP machines, both design and function are upgraded according to the feedbacks from our customers.
2. We have more than a professional R&D team and rich experienced engineers, who can provide the perfect solution for the customers.
3. Most of the electrical parts we use are imported from the world-famous suppliers in Japan, France, Swiss, USA, etc. （Panasonic motors, Schneider inverters& switch, Carlo SSR& relay） Our machines’ good and stable quality is highly approved by our customers. That is why our oversea sales becomes better and better.
4. Fast delivery time, we can finish a standard reflow oven with 8 heating zones within 10 days.
5. Very competitive price and best support to all customers.
6. OEM service is available according to some customer’s requirements.
Our Customers
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