HX-V1040B Vacuum Reflow Soldering Oven-4 Cooling Zones

Clean & efficient hood design, provides better soldering results when producing larger PCBs.

Intelligent PCB input beat, as long as the vacuum time and pressure relief time are set, the interval time between PCBs is automatically calculated.

SKU: HX-V1040B Categories: SMT Series, Vacuum Reflow Oven

Basic parameters
Models	HX-V1040B
Dimension (mm）	L6025D1350H1500
Weight	APPROX:3000KG
Number of heating zones	Top 10 /bottom 10
Number of cooling zones	Top 4 /bottom 4
Cooling method	Forced water cooling
Exhaust requirements	10m3 /H*2
Void rate	APPROX:1%-2%
Control system
Power requirements	3P 380V 50/60Hz
Total power	70KW
Segmented starting power	40KW
Power consumption	APPROX：13KW
Hot air blower speed regulation	Inverter & stepless speed regulation
Heating time	APPROX：30min
Temperature control range	Room temperature ~ 320 °C can be set
Production recipes	Multi-combination production recipes can be stored
Transportation
Number of lanes	Single lane
Rail structure	3-segment combined structure
Pallet dimension （mm）	L400D400H50
Conveyor height （mm）	900±20
Mode of transportation	Three-segment chain drive
Vacuum system
Minimum vacuum pressure	0.1Kpa
Vacuum pump flow	1000L/min
Pressure relief time	≤10s
Production efficiency	≥40s
Optional nitrogen system
Nitrogen structure	Full/local nitrogen filling
Nitrogen system	Automatic
Nitrogen consumption	APPROX：300-600L/min

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