HSM-1012VN Semiconductor Vacuum Oven

The patented module heating structure, more accurate temperature control, with little temp.difference, and better soldering effect.

The entrance lifting height and transportation adopt stepper servo, which can meet the production needs of different products.

SKU: HSM-1012VN Categories: Semiconductor Series, Vacuum Reflow Oven

Models	HSM-1012VN
Dimension (mm)	L2200D1450H1818
Weight	APPROX:1400KG
Number of top heating zones	3
Top heating method	Thermal radiation
Number of bottom heating zones	10
Bottom heating method	Contacting
Number of cooling zone	2
Number of vacuum zones	1
Heating panel length	340mm
Heating panel width	90mm
Product thickness	0.2-5mm
Production efficiency	≤120PCS/H
Max. temperature	420℃
Min. O2 content	50ppm
Heating panel temp. difference	≤±3℃
Power supply	3P 380V 50/60Hz
Total power	32kw
Power consumption	≤7kw
Compressed air pressure	≥5kg/cm2
Protection air pressure	2.5kg/cm2
Water flow rate	10-25L/min
N2 consumption	APPROX:150-200L/min
Void rate	Appx.:1%-2%

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