HSM-812VN Semiconductor Vacuum Oven
This equipment uses the imported platform, specialized for SOP, SOT, DIP, QFN, QFP, BGA, IGBT, TO, MINI LED and other vacuum chip package soldering.
This equipment adopts industrial embedded control system, with dual CPU calculation, can run independently from the computer (computer crash), not only stable and reliable but also more accurate in temperature control, provide replaceable heating modules, to effectively solve the phenomenon of tin frying caused by temperature difference.
Exclusive patented flux & paste collection system reduces equipment maintenance and cleaning.
|
Models |
HSM-812VN |
| Dimension (mm) |
L2200*D1450*H1818 |
|
Weight |
APPROX:1400KG |
| Number of top heating zones |
3 |
|
Top heating method |
Thermal radiation |
| Number of bottom heating zones |
8 |
|
Bottom heating method |
Contacting |
| Number of cooling zone |
2 |
|
Number of vacuum zones |
1 |
| Heating panel length |
340mm |
|
Heating panel width |
120mm |
| Product thickness |
0.2-5mm |
|
Production efficiency |
≤120PCS/H |
| Max. temperature |
420℃ |
|
Min. O2 content |
50ppm |
| Heating panel temp. difference |
≤±3℃ |
|
Power supply |
3P 380V 50/60Hz |
| Total power |
28kw |
|
Power consumption |
≤5kw |
| Compressed air pressure |
≥5kg/cm2 |
|
Protection air pressure |
2.5kg/cm2 |
| Water flow rate |
8-20L/min |
|
N2 consumption |
APPROX:150-200L/min |
| Void rate |
Appx.:1%-2% |
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