HTC-612D Semiconductor Vacuum Oven-2 Cooling Zones

Patented cooled flux recollection system for easier maintenance and cleaning.

Nitrogen is input independently in each zone, with closed-loop control, nitrogen concentration is high and consumption is less.

SKU: HTC-612D Categories: Semiconductor Series, Vacuum Reflow Oven

Basic parameters
Models	HTC-612D
Dimension （mm）	L6300D1450H1560
Weight	APPROX: 3000KG
Number of heating zones	Top 6/ bottom 6
Number of cooling zones	Top 2/ bottom 2
Cooling method	Forced ice cooling
Exhaust requirements	10m3 /H*2
Void rate	APPROX:1%-2%
Control system
Power requirements	3P 380V 50/60Hz
Total power	60KW
Segmented starting power	35KW
Power consumption	APPROX: 12KW-18KW
Hot air blower speed regulation	Inverter stepless speed regulation
Heating time	APPROX: 30min
Temperature control range	Room temperature ~ 400 °C can be set
Production recipes	Multi-combination production recipes can be stored
Transportation
Number of lanes	Single lane
Rail structure	3-segment combined structure
Pallet dimension(mm)	L330*D250
Conveyor height(mm)	900±20
Mode of conveying	Isometric board-pushing
Vacuum system
Minimum vacuum pressure	0.1Kpa
Vacuum pump flow	APPROX: 1000L/min
Pressure relief time	≤10s
Production efficiency	≥40 s
Optional nitrogen system
Nitrogen structure	Full/partial nitrogen filling
Nitrogen system	Automatic
Nitrogen consumption	APPROX: 300-500L/min

There are no reviews yet.