Basic parameters | |
Models |
HX-F1030DL |
Dimension (mm) |
L7100*D1680*H1600 |
Weight |
Approx.:3500KG |
Number of heating zones |
Top 10 /bottom 10 |
Number of cooling zones |
Top 3 /bottom 3 |
Cooling method |
Forced water cooling |
Exhaust requirements |
10m3 /H*2 |
Void rate |
APPROX:1%-2% |
Control system | |
Power requirements |
3P 380V/220/480 50/60Hz |
Total power |
85KW |
Segmented starting power |
50KW |
Power consumption |
Approx:13-20KW |
Hot air blower speed regulation |
Inverters |
Heating time |
APPROX:30min |
Temperature control range |
Room temperature ~ 300 °C can be set |
Production recipes |
Multi-combination production recipes can be stored |
Transportation | |
Rail structure |
Dual lane |
Vacuum structure |
Single chamber |
Pallet dimension (mm) |
L400*D250 |
Conveyor height (mm) |
900±20 |
Mode of conveying |
Chain drive |
Vacuum system | |
Minimum vacuum pressure |
0.1Kpa |
Vacuum pump flow |
1000L/min |
Pressure relief time |
≤10s |
Production efficiency |
≥40s |
Optional nitrogen system | |
Nitrogen structure |
Full/local nitrogen filling |
Nitrogen system |
Automatic/manual |
Nitrogen consumption |
Approx.700L/min |
HX-F1030DL Vacuum Reflow Oven
The embedded control switching system with independent intellectual property rights can realize the simultaneous operation of touch, keyboard and mouse.
The control system adopts embedded dual CPU, which can turn off the computer and run independently, running faster and more perfect.
SKU: HX-F1030DL
Categories: SMT Series, Vacuum Reflow Oven
Be the first to review “HX-F1030DL Vacuum Reflow Oven” Cancel reply
Related products
Semiconductor Series
Semiconductor Series
Semiconductor Series
Semiconductor Series
SMT Series
SMT Series
Semiconductor Series
Reviews
There are no reviews yet.