HTC-613D Semiconductor Vacuum Oven-3 Cooling Zones
The air transport adopts microcirculation, and the temperature difference inside the zones is smaller.
The equidistant PCB-push structure is adopted, and there is no sensor inside the hood to limit the product distance, which can realize soldering under high-temperature.
| Basic parameters | |
|
Models |
HTC-613D |
| Dimension （mm） |
L6300*D1450*H1560 |
|
Weight |
APPROX：3100KG |
| Number of heating zones |
Top 6/ bottom 6 |
|
Number of cooling zones |
Top 3/ bottom 3 |
| Cooling method |
Forced ice cooling |
|
Exhaust requirements |
10m3 /H*2 |
| Void rate |
APPROX:1%-2% |
| Control system | |
|
Power requirements |
3P 380V 50/60Hz |
| Total power |
64KW |
|
Segmented starting power |
35KW |
| Power consumption |
APPROX：13KW-18KW |
|
Hot air blower speed regulation |
Inverter stepless speed regulation |
| Heating time |
APPROX：30min |
|
Temperature control range |
Room temperature ~ 400 °C can be set |
| Production recipes |
Multi-combination production recipes can be stored |
| Transportation | |
|
Number of lanes |
Single lane |
|
Rail structure |
3-segment combined structure |
| Pallet dimension(mm) |
L330*D330 |
|
Conveyor height(mm) |
900±20 |
| Mode of conveying |
Isometric board-pushing |
| Vacuum system | |
|
Minimum vacuum pressure |
0.1Kpa |
| Vacuum pump flow |
APPROX：1000L/min |
|
Pressure relief time |
≤10s |
| Production efficiency |
≥40 s |
| Optional nitrogen system | |
|
Nitrogen structure |
Full/partial nitrogen filling |
|
Nitrogen system |
Automatic |
| Nitrogen consumption |
APPROX：300-500L/min |
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