HX-V1030C Vacuum Reflow Soldering Oven-3 Cooling Zones

Nitrogen is input independently in each zone, with closed-loop control, nitrogen concentration is high and consumption is less.

The embedded switching system with independent intellectual property rights, can realize the simultaneous operation of touch, keyboard and mouse.

SKU: HX-V1030C Categories: SMT Series, Vacuum Reflow Oven

Basic parameters
Models	HX-V1030C
Dimension (mm）	L6025D1350H1500
Weight	APPROX:3000KG
Number of heating zones	Top 10 /bottom 10
Number of cooling zones	Top 3 /bottom 3
Cooling method	Forced water cooling
Exhaust requirements	10m3 /H*2
Void rate	APPROX:1%-2%
Control system
Power requirements	3P 380V 50/60Hz
Total power	75KW
Segmented starting power	45KW
Power consumption	APPROX：14KW
Hot air blower speed regulation	Inverter & stepless speed regulation
Heating time	APPROX：30min
Temperature control range	Room temperature ~ 320 °C can be set
Production recipes	Multi-combination production recipes can be stored
Transportation
Number of lanes	Single lane
Rail structure	3-segment combined structure
Pallet dimension （mm）	L500D700H50
Conveyor height （mm）	900±20
Mode of transportation	Three-segment chain drive
Vacuum system
Minimum vacuum pressure	0.1Kpa
Vacuum pump flow	1500L/min
Pressure relief time	≤10s
Production efficiency	≥40s
Optional nitrogen system
Nitrogen structure	Full/local nitrogen filling
Nitrogen system	Automatic
Nitrogen consumption	APPROX：300-600L/min

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