Basic parameters | |
Models |
HX-F1030DS |
Dimension (mm) |
L7100*D1680*H1600 |
Weight |
Approx.:3500KG |
Number of heating zones |
Top 10 /bottom 10 |
Number of cooling zones |
Top 3 /bottom 3 |
Cooling method |
Forced water cooling |
Exhaust requirements |
10m3 /H*2 |
Void rate |
APPROX:1%-2% |
Control system | |
Power requirements |
3P 380V/220/480 50/60Hz |
Total power |
90KW |
Segmented starting power |
50KW |
Power consumption |
Approx:12-20KW |
Hot air blower speed regulation |
Inverters |
Heating time |
APPROX:30min |
Temperature control range |
Room temperature ~ 300 °C can be set |
Production recipes |
Multi-combination production recipes can be stored |
Transportation | |
Rail structure |
Dual lane |
Vacuum structure |
Dual chamber |
Pallet dimension (mm) |
L400*D250 |
Conveyor height (mm) |
900±20 |
Mode of conveying |
Chain drive |
Vacuum system | |
Minimum vacuum pressure |
0.1Kpa |
Vacuum pump flow |
1000L/min |
Pressure relief time |
≤10s |
Production efficiency |
≥40s |
Optional nitrogen system | |
Nitrogen structure |
Full/local nitrogen filling |
Nitrogen system |
Automatic/manual |
Nitrogen consumption |
Approx.700L/min |
HX-F1030DS Vacuum Reflow Oven
Top vacuum structure, more convenient maintenance and higher reliability.
The vacuum chamber has a built-in heating system to prevent premature cooling in the vacuum chamber, resulting in vacuum invalidity.
SKU: HX-F1030DS
Categories: SMT Series, Vacuum Reflow Oven
Be the first to review “HX-F1030DS Vacuum Reflow Oven” Cancel reply
Related products
Semiconductor Series
Semiconductor Series
Semiconductor Series
Semiconductor Series
Semiconductor Series
SMT Series
Reviews
There are no reviews yet.