HPK-400 Formic Acid Reflow Soldering Oven
The equipment is equipped with cooling pipes, vacuum system pipes and formic acid atomization systems, and has a built-in sealing ring for the cold water pipe, which not only has a longer life, lower usage costs, but also reduces product damage caused by poor sealing.
|
Demission |
Approx. 4275*1625*1750 |
| Configuration |
1 equipment body, 2 conveyors, 1 chiller, one set of vacuum boxes |
|
Max. temperature |
400 ℃, (400-450 optional) |
| Heating zone |
4 (3 heating zones, 1 cooling zone) |
|
Min. Vacuum value |
<5Pa |
| Vacuum time |
15-30s |
|
Max. product size |
330*470mm |
| Cooling speed |
1-10℃/min，can be set |
|
Chamber height |
100mm (Suitable for soldering workpieces or pallet up to 50mm high) |
| Cooling method |
Water cooling+N2 cooling; Equipped with water cooling system for contact cooling |
|
Ultimate vacuum value |
Below 5pa |
| Heating method |
Contact heating |
|
Top heating |
Radiation heating |
| Void rate |
≦2% |
|
Formic acid process |
Can satisfy |
| N2 and H2 mixed gas |
Can satisfy |
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