HSM-1012VNL Semiconductor Vacuum Oven
Perfect shielding gas filling and exhaust gas recovery structure, makes the gas inside the oven more uniform and cleaner.
The independent nitrogen-hydrogen mixture filling system, realizes nitrogen filling in the preheating area and nitrogen-hydrogen mixture in the soldering area, which is more economical and with better protection effect.
| Models | HSM-1012VNL |
| Dimension (mm) |
L2800*D1450*D1818 |
|
Weight |
APPROX:1500KG |
| Number of top heating zones |
3 |
|
Top heating method |
Thermal radiation |
| Number of bottom heating zones |
10 |
|
Bottom heating method |
Contacting |
| Number of cooling zone |
2 |
|
Number of vacuum zones |
1 |
| Heating panel length |
340mm |
|
Heating panel width |
130mm |
| Product thickness |
0.2-5mm |
|
Production efficiency |
≤120PCS/H |
| Max. temperature |
420℃ |
|
Min. O2 content |
50ppm |
| Heating panel temp. difference |
≤±3℃ |
|
Power supply |
3P 380V 50/60Hz |
| Total power |
35kw |
|
Power consumption |
≤8kw |
| Compressed air pressure |
≥5kg/cm2 |
|
Protection air pressure |
2.5kg/cm2 |
| Water flow rate |
10-25L/min |
|
N2 consumption |
APPROX:150-200L/min |
| Void rate |
Appx.:1%-2% |
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