HSM-1013VNL Semiconductor Vacuum Oven
The feeding unit is made of dust-free roller + straightening mechanism, with preheating area, which can realize the accurate movement of the product to the center of the heater.
The patented receiving protection mechanism, when the magazine is deformed, it is automatically transferred to the spare magazine, which doesn’t delay production, and also prevent the product from being damaged in the oven.
|
Models |
HSM-1013VNL |
| Dimension (mm) |
L2800*D1450*H1818 |
|
Weight |
APPROX:1550KG |
| Number of top heating zones |
3 |
|
Top heating method |
Thermal radiation |
| Number of bottom heating zones |
10 |
|
Bottom heating method |
Contacting |
| Number of cooling zone |
3 |
|
Number of vacuum zones |
1 |
| Heating panel length |
340mm |
|
Heating panel width |
120mm |
| Product thickness |
0.2-5mm |
|
Production efficiency |
≤120PCS/H |
| Max. temperature |
420℃ |
|
Min. O2 content |
50ppm |
| Heating panel temp. difference |
≤±3℃ |
|
Power supply |
3P 380V 50/60Hz |
| Total power |
35kw |
|
Power consumption |
≤8kw |
| Compressed air pressure |
≥5kg/cm2 |
|
Protection air pressure |
2.5kg/cm2 |
| Water flow rate |
10-25L/min |
|
N2 consumption |
APPROX:150-200L/min |
| Void rate |
Appx.:1%-2% |
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